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2.9 Relevance of the hysteresis on normal device operation

The hysteresis effect discussed in this work is an outstanding difference between silicon and silicon carbide based MOSFETs. It is an intrinsic feature of MOSFETs based on wide bandgap semiconductor substrates. The reported hysteresis effect is visible on both investigated crystal faces and mainly present in the subthreshold regime, where the on-resistance (math image) of the device is still in the range of several megaohms. In saturation mode above threshold (\( \ac {vg}\geq \ac {Vth} \), see inset in Fig. 2.1) the hysteresis vanishes. Consequently, the reported subthreshold hysteresis does not cause a dynamic change of (math image) during normal operation on a-face and Si-face devices and its impact on hard switching operation (e.g. switching very fast between accumulation and inversion) is negligible.

Figure 2.36: Drain current overshoot due to the hysteresis effect for switching gate bias with the high level close to (math image) (left) and higher (right). The overshoot of the drain current strongly depends on the minority carrier density in the channel and is therefore less important for typical operating conditions above (math image) (right).

It is important to emphasize that the reported hysteresis is not identical to classical BTI and cannot be considered as degradation. It is a fully reversible and reproducible effect which occurs on SiC-based MOSFETs and may have the following effects in the application:

According to available literature on the hysteresis [29, 43, 111], it has no negative effect on the performance and on the reliability of SiC MOSFETs. Nevertheless, it needs to be considered and understood in order to include the effect into circuit simulation and to correctly perform and assess threshold voltage measurements and BTI, as will be explained in Chapter 3.

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