Erasmus Langer
Siegfried Selberherr
Oskar Baumgartner
Markus Bina
Hajdin Ceric
Johann Cervenka
Raffaele Coppeta
Lado Filipovic
Lidija Filipovic
Wolfgang Gös
Klaus-Tibor Grasser
Hossein Karamitaheri
Hans Kosina
Hiwa Mahmoudi
Alexander Makarov
Mahdi Moradinasab
Mihail Nedjalkov
Neophytos Neophytou
Roberto Orio
Dmitry Osintsev
Mahdi Pourfath
Florian Rudolf
Franz Schanovsky
Anderson Singulani
Zlatan Stanojevic
Viktor Sverdlov
Stanislav Tyaginov
Michael Waltl
Josef Weinbub
Yannick Wimmer
Thomas Windbacher
Wolfhard Zisser

Raffaele Coppeta
MSc
coppeta(!at)iue.tuwien.ac.at
Biography:
Raffaele Alberto Coppeta was born in Torino, Italy, in 1986. He studied material engineering at the Politecnico of Torino, where he received the bachelor degree in 2009 and the master degree in 2011. He joined the Institute for Microelectronics in 2012, where he is currently working on his doctoral degree. His scientific interests include thermo-mechanical stress modeling using the finite element method for GaN-on-Si chips.

Modeling of the Residual Stress in GaN Thin Film Grown on Si Substrate

GaN is considered as a promising semiconductor due to its wide bandgap, high breakdown field, high electron mobility and sheet carrier density making it ideal for power applications. Si substrate is used due to its low cost and wide availability. The problems of the integration of GaN thin films on Si substrates arise due its specific physical and chemical properties.
It has been demonstrated that it is not possible to grow monocrystalline GaN directly on Si substrates due to the large lattice, thermal, and chemical potential mismatch. For these reasons different kinds of buffer layer schemes between Si and GaN have been invented. The simplest buffer is an AlN thin layer. Another solution is a graded AlGaN layer. In all cases, the growth mode of a III-nitride thin layer upon a Si substrate is the so-called island growth, also known as the Volmer-Weber growth. It implies that a polycrystalline buffer layer is created and several columnar grains separated by low-angle grain boundaries and domain walls compose it. Dislocations composing these low-angle grain boundaries propagate into the layers above, included the GaN layer, affecting its electronic and optical properties.
I investigate the Volmer-Weber growth of the III-nitrides on silicon and the subsequent low-angle grain boundaries formation using analytical models based on energetic minimization criterions and with the aid of mechanical simulations performed by a finite element method software.
Additional dislocations are formed when GaN is grown above the buffer layer. This happens through the Frank-VanDerMerwe growth. In this situation, dislocations are created when the GaN thickness is higher than a critical value. Several criterions, like the People-Bean and the Matthews-Blakeslee methods, allow prediction of the critical thickness value. The aim is to describe the relaxation process due to the dislocations' dynamics by means of mathematical models and combine these results with, firstly, the influences of the Volmer-Weber grown buffer layer and, secondly, with the inverse piezoelectric effect — that characterizes the III-nitride's — influences.


Experimental stress-thickness curve typical for an AlN thin film grown by the Volmer-Weber mode on Si substrate.


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