Chapter 6
Short-Term NBTI

During long-term stress, most measurements indicate that ΔVTH   follows a power-law as Atn  [749102103]. However, log-like behavior, in particular at short times, has also been reported [841140]. Both cases are depicted in Fig. 6.1 and Fig. 6.2.


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Figure 6.1: A pMOS with tox = 1.4nm  SiON  yields a different stress behavior when comparing the short-term to the long-term behavior and the question arises whether there are two mechanisms contributing to NBTI or one. Unscaled stress and restress phases of the extended MSM sequence provided by Kaczer et al. [1718].



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Figure 6.2: A pMOS with tox = 1.4nm  SiON  yields a different stress behavior when comparing the short-term to the long-term behavior and the question arises whether there are two mechanisms contributing to NBTI or one. Scaling the data shown left gives a universal curve which more clearly reveals the log(t) versus the power-law dependence.


The conventional explanation of the resulting degradation uses elastic hole trapping due to tunneling carrier exchange with the substrate (initial degradation) [8411] and the creation of interface states (long-term degradation) [94104]. While [94104] claim that processes in the short-time scale show a negligible temperature dependence, the latest results support a thermally activated tunneling mechanism [9878105] (cf. Chapter 5).

Previous short-time measurements using conventional parameter analyzers with a time resolution in the millisecond regime indicate that at least for up to medium stresses a logarithmic time dependence is observed during the first three decades (1ms  up to 1s  ) [106]. This logarithmic short-term degradation shows a strong temperature activation and a quadratic stress field dependence (∼E2
    ox   ) up to medium stress (≈ 5MV  ∕cm  ). For longer stress times and higher stress fields (≈ 7MV  ∕cm  ), degradation starts to deviate from the logarithmic behavior [10698].

To better understand the underlying mechanisms of short-term NBTI degradation, an extensive study of the short stress time behavior far below the range of milliseconds to seconds needs to be performed. Unfortunately, accurate measurements in these time scales are difficult to access due to noise [10742]. In particular, the noise in the μs  regime makes it difficult to extract information on the smallest time-constants contributing to the degradation. The currently used measurement methods for fast NBTI evaluation [12] are briefly summarized, based on Chapter 2:

(i) The fast-VTH   method [1115] (Chapter 2.1.2) interrupts the stress (μs  delay) to quickly record VTH   during recovery.

(ii) The fast-ID   method [18171063020] (Chapter 2.1.1) monitors the drain current ID   near VTH   , which is then converted to ΔVTH   [106] using an initial I (V  )
 D   G  curve. This characteristic is only recorded around V
  TH   so as not to prestress the device.

(iii) The on-the-fly (OTF) method [36286] records the degradation during stress and hence does not introduce unwanted recovery, but suffers from mobility degradation, which leads to a spurious ΔVTH   [10841] (Chapter 2.3).

While OTF suffers from the problem of the initial reference measurement, which already stresses the device, the fast-V
 TH   and the fast-I
 D   methods can record an unstressed reference value but suffer from the delay during measurement [1812]. Due to its non-stop recording nature, methods (i) and (ii) [1812] can continuously monitor recovery and, thus, allow an extrapolation back to shorter measuring delays.

Based on this experience fast rectangular gate pulses are used for short-term NBTI degradation in the range of 1μs  to 1s  here. Recalling that previously published results [106] only feature a minimum time of 1ms  means that the number of decades in time for short-term degradation is doubled from three to six. This method is called improved fast pulse method (Chapter 2.2.2) and will be explained thoroughly in the next two sections and is finally compared against the fast-VTH   method of [15].

 6.1 Gate Pulse Settings
 6.2 Data Extraction
  6.2.1 Offset
  6.2.2 Initial Measurement as Reference
  6.2.3 Gate Voltage Criteria
  6.2.4 Brute-Force Truncation of the Transient
  6.2.5 Final Setting of Parameters
 6.3 Logarithmic Stress Behavior
  6.3.1 Used Samples and Stress Conditions
  6.3.2 Temperature Scaling
  6.3.3 Voltage Scaling
  6.3.4 Oxide Thickness Scaling
  6.3.5 Extracted Prefactors
 6.4 Power-Law Stress Behavior
 6.5 Relaxation Behavior
 6.6 Fast Ramp versus Fast-VTH   -Method
 6.7 Conclusions