TCAD has become an attractive alternative to full wafer flows in
the fabrication facility. The services of TCAD are utilized in
order to reduce the development costs of a fabrication technology by
substituting simulations for split run experiments. Moreover, TCAD
offers detailed insight into the operation of microelectronic devices,
which would be extremely difficult to achieve otherwise. As shown in
Figure 2.1, TCAD as a discipline can be divided into
a couple of areas that are occupied either by process development
engineers, or by TCAD-support engineers. This chapter will outline
the scope of existing tools for various TCAD tasks. Moreover, the
methodologies of their usage are sketched.
![\begin{Figure}
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\includegraphics[width=0....
...h]{fig/tcad/tcad-disciplines}\caption{
Technology CAD disciplines.}
\end{Figure}](img7.gif)