Erasmus Langer
Siegfried Selberherr
Oskar Baumgartner
Markus Bina
Hajdin Ceric
Johann Cervenka
Lado Filipovic
Wolfgang Gös
Klaus-Tibor Grasser
Hossein Karamitaheri
Hans Kosina
Hiwa Mahmoudi
Alexander Makarov
Marian Molnar
Mahdi Moradinasab
Mihail Nedjalkov
Neophytos Neophytou
Roberto Orio
Dmitry Osintsev
Vassil Palankovski
Mahdi Pourfath
Karl Rupp
Franz Schanovsky
Anderson Singulani
Zlatan Stanojevic
Ivan Starkov
Viktor Sverdlov
Oliver Triebl
Stanislav Tyaginov
Paul-Jürgen Wagner
Michael Waltl
Josef Weinbub
Thomas Windbacher
Wolfhard Zisser

Hajdin Ceric
Dipl.-Ing. Dr.techn.
ceric(!at)iue.tuwien.ac.at
Biography:
Hajdin Ceric was born in Sarajevo, Bosnia and Herzegovina, in 1970. He studied electrical engineering at the Electrotechnical Faculty of the University of Sarajevo and the Technische Universität Wien, where he received the degree of Diplomingenieur in 2000. In June 2000, he joined the Institute for Microelectronics, where he received the doctoral degree in technical sciences in 2005 and where he is currently employed as a post-doctoral researcher. His scientific interests include interconnect and process simulation.

Atomistic Methods for Analysis of Electromigration

The reliability of interconnects in modern integrated circuits is determined by the magnitude and direction of the effective valence for ElectroMigration (EM). The effective valence depends on local atomistic configurations. In order to study EM at an atomistic level, application of ab initio methods is necessary. EM experiments indicate that the copper interconnect lifetime decreases with every new interconnect generation. In particular, fast diffusivity paths cause a significant variation in the interconnect performance and EM degradation. In order to produce more reliable interconnects, the fast diffusivity paths must be addressed when introducing new designs and materials. The EM lifetime depends on a variation of material properties at the microscopic and atomistic levels. Microscopic properties are grain boundaries and grains with their crystal orientation. Atomistic properties are configurations of atoms at the grain boundaries, at the interfaces to the surrounding layers, and at the cross-section between grain boundaries and interfaces. Modern Technology Computer-Aided Design (TCAD) tools, used in order to meet the challenges of contemporary interconnects, must cover two major areas: physically based continuum-level modeling and first principles/atomistic-level modeling.
We investigate computationally efficient ab initio methods for calculation of the effective valence for EM and the atomistic EM force. The results of these ab initio calculations are applied for parameterization of a continuum-level model and for simulation of the impact of the copper microstructure on the EM behavior. Additionally, an application of the kinetic Monte Carlo method in combination with ab initio methods for EM study is utilized.
Several methods have been proposed for the calculation of the effective valence, all of them based on the computation of electron scattering states, such as the Density Functional Theory (DFT), in connection with the Augmented Plane Wave (APW) method or the Korringa-Kohn-Rostoker (KKR) method. Since all of the previous methods demand cumbersome representation of scattering wave functions with many parameters, which is a heavy burden on the stability and accuracy of subsequent numerical steps, we introduce and investigate new approaches, which are based on orbital electron density.


Portion of the bulk copper crystal. The electron density is represented in two orthogonal planes. It varies from higher values (circle regions around atoms) closer to the atomic nucleus to lower in the inter-atomic space.


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