Erasmus Langer
Siegfried Selberherr
Oskar Baumgartner
Markus Bina
Hajdin Ceric
Johann Cervenka
Lado Filipovic
Wolfgang Gös
Klaus-Tibor Grasser
Hossein Karamitaheri
Hans Kosina
Hiwa Mahmoudi
Alexander Makarov
Marian Molnar
Mahdi Moradinasab
Mihail Nedjalkov
Neophytos Neophytou
Roberto Orio
Dmitry Osintsev
Vassil Palankovski
Mahdi Pourfath
Karl Rupp
Franz Schanovsky
Anderson Singulani
Zlatan Stanojevic
Ivan Starkov
Viktor Sverdlov
Oliver Triebl
Stanislav Tyaginov
Paul-Jürgen Wagner
Michael Waltl
Josef Weinbub
Thomas Windbacher
Wolfhard Zisser

Roberto Orio
MSc Dr.techn.
orio(!at)iue.tuwien.ac.at
Biography:
Roberto Lacerda de Orio was born in Sao Paulo, Brazil, in 1981. He studied electrical engineering at the State University of Campinas, where he received a master's degree in 2006. He joined the Institute for Microelectronics in October 2006, where he received his doctoral degree in 2010 and where he is currently employed as a post-doctoral researcher. His main scientific interests include modeling and simulation of electromigration and stress-induced phenomena on interconnects.

Electromigration Lifetime Extrapolation for Copper Dual-Damascene Interconnects

ElectroMigration (EM) lifetimes are commonly described by Black's equation. After fitting it to experimental data, Black's equation is used to extrapolate results from accelerated tests to operating conditions. This extrapolation methodology is based on the critical assumption that the parameters obtained from accelerated experiments are also valid at the lower temperature and the lower current density at normal operation. Thus, the failure mechanism, or more generally, the dominant physical effects during accelerated tests are considered to remain the same under use conditions. However, it has been shown that the parameters obtained from Black's equation fit are not directly applicable to lifetime extrapolation.
We have developed an approach for lifetime extrapolation based on a more rigorous physical model for EM failure of copper dual-damascene interconnects. Figure 1 shows the extrapolation of EM lifetimes for several current densities. The model was first calibrated for 1.33MA/cm². Then, using the same set of parameters, the lifetimes for other current densities were calculated. As figure 1 shows, the extrapolated (simulated) lifetimes are in good agreement with the experimental results. In particular, the simulations closely follow the experiments for all failure percentiles. Figure 2 shows the lifetime extrapolation to lower temperatures. The model was calibrated for 342°C. A very good agreement between simulation and experiment is obtained at higher temperatures, for all failure percentiles. However, at lower temperatures a significant lifetime difference is observed for small failure percentiles. The simulations predict a smaller standard deviation than the experimental one. The significant change of the standard deviation with temperature observed experimentally indicates that the EM failure mechanism has changed in such a way that the proposed model cannot completely describe it.
We observed that the approach applied above yielded better extrapolation results than the standard methodology based on Black's equation. This is a consequence of the more rigorous model we developed. Furthermore, the proposed approach requires a detailed analysis of the experimental data and associated failure mechanisms, which leads to a more suitable description of the problem and, consequently, to a more precise extrapolation.


Figure 1. EM lifetime extrapolation for several current densities.



Figure 2. EM lifetime extrapolation to lower temperatures.


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