Publications Christoph Lenz
9 records
2. | C. Lenz, P. Manstetten, L.F. Aguinsky, F. Rodrigues, A. Hössinger, J. Weinbub: "Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations"; Solid-State Electronics, 200, (invited) (2022), doi:10.1016/j.sse.2022.108534. BibTeX |
1. | C. Lenz, A. Toifl, M. Quell, F. Rodrigues, A. Hössinger, J. Weinbub: "Curvature Based Feature Detection for Hierarchical Grid Refinement in TCAD Topography Simulations"; Solid-State Electronics, 191, (invited) (2022), 108258-1 - 108258-8 doi:10.1016/j.sse.2022.108258. BibTeX |
2. | C. Lenz, A. Scharinger, P. Manstetten, A. Hössinger, J. Weinbub: "A Novel Surface Mesh Simplification Method for Flux-Dependent Topography Simulations of Semiconductor Fabrication Processes"; in "Scientific Computing in Electrical Engineering", M. van Beurden, N. Budko, W. Schilders (ed); Springer, 2021, ISBN: 978-3-030-84238-3, 73 - 81 doi:10.1007/978-3-030-84238-3_8. BibTeX |
1. | C. Lenz, A. Toifl, A. Hössinger, J. Weinbub: "Curvature Based Feature Detection for Hierarchical Grid Refinement in TCAD Topography Simulations"; in "Proceedings of the 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", B. Cretu (ed); IEEE, 2021, 1 - 4 doi:10.1109/EuroSOI-ULIS53016.2021.9560690. BibTeX |
4. | C. Lenz, P. Manstetten, A. Hössinger, J. Weinbub: "Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022), Granada, Spain; 2022-09-06 - 2022-09-08; in "SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet", (2022), 11 - 12. BibTeX |
3. | C. Lenz, A. Toifl, A. Hössinger, J. Weinbub: "Curvature-Based Feature Detection for Hierarchical Grid Refinement in Epitaxial Growth Simulations"; Talk: Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS), Caen, France; 2021-09-01 - 2021-09-03; in "Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS)", (2021), 109 - 110. BibTeX |
2. | C. Lenz, A. Scharinger, M. Quell, P. Manstetten, A. Hössinger, J. Weinbub: "Evaluating Parallel Feature Detection Methods for Implicit Surfaces"; Talk: Austrian-Slovenian HPC Meeting (ASHPC), Maribor, Slovenia (Virtual); 2021-05-31 - 2021-06-02; in "Book of Abstracts of the Austrian-Slovenian HPC Meeting (ASHPC)", (2021), 31. BibTeX |
1. | C. Lenz, A. Scharinger, A. Hössinger, J. Weinbub: "A Novel Surface Mesh Coarsening Method for Flux-Dependent Topography Simulations of Semiconductor Fabrication Processes"; Talk: International Conferences on Scientific Computing in Electrical Engineering (SCEE), Eindhoven, The Netherlands; 2020-02-16 - 2020-02-20; in "Book of Abstracts of the International Conferences on Scientific Computing in Electrical Engineering (SCEE)", (2020), 99 - 100. BibTeX |
1. | C. Lenz: "Curvature Based Surface Mesh Simplification"; Supervisor: H. Pottmann, J. Weinbub; Institut für Diskrete Mathematik und Geometrie und Institut für Mikroelektronik, 2019, final examination: 2019-06-06. BibTeX |