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Publications Wolfgang Pyka

21 records

Publications in Scientific Journals

7.  C. Heitzinger, W. Pyka, N. Tamaoki, T. Takase, T. Ohmine, S. Selberherr:
"Simulation of Arsenic In Situ Doping With Polysilicon CVD and Its Application to High Aspect Ratio Trenches";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 22 (2003), 3; 285 - 292. https://doi.org/10.1109/TCAD.2002.807879

6.  H. Puchner, R. Castagnetti, W. Pyka:
"Minimizing Thick Resist Sidewall Slope Dependence on Design Geometry by Optimizing Bake Conditions";
Microelectronic Engineering, 53 (2000), 429 - 432.

5.  W. Pyka, R. Martins, S. Selberherr:
"Optimized Algorithms for Three-Dimensional Cellular Topography Simulation";
IEEE Journal of Technology Computer Aided Design, 1 (2000), 20; 1 - 36. https://doi.org/10.1109/TCAD.1996.6449177

4.  W. Pyka, H. Kirchauer, S. Selberherr:
"Three-Dimensional Resist Development Simulation - Benchmarks and Integration with Lithography";
Microelectronic Engineering, 53 (2000), 1-4; 449 - 452. https://doi.org/10.1016/S0167-9317(00)00353-1

3.  P. Fleischmann, W. Pyka, S. Selberherr:
"Mesh Generation for Application in Technology CAD";
IEICE Transactions on Electronics (invited), E82-C (1999), 6; 937 - 947.

2.  W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18 (1999), 12; 1741 - 1749. https://doi.org/10.1109/43.811323

1.  R. Martins, W. Pyka, R. Sabelka, S. Selberherr:
"High-Precision Interconnect Analysis";
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17 (1998), 11; 1148 - 1159. https://doi.org/10.1109/43.736187

Talks and Poster Presentations (with Proceedings-Entry)

11.  A. Hössinger, T. Binder, W. Pyka, S. Selberherr:
"Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation";
Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6; 424 - 427. https://doi.org/10.1007/978-3-7091-6244-6_98

10.  W. Pyka, C. Heitzinger, N. Tamaoki, T. Takase, T. Ohmine, S. Selberherr:
"Monitoring Arsenic In-Situ Doping with Advanced Models for Poly-Silicon CVD";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6; 124 - 127. https://doi.org/10.1007/978-3-7091-6244-6_27

9.  W. Pyka, S. Selberherr, V. Sukharev:
"Incorporation of Equipment Simulation into Integrated Feature Scale Profile Evolution";
Talk: European Solid-State Device Research Conference (ESSDERC), Cork; 2000-09-11 - 2000-09-13; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2000), ISBN: 2-86332-248-6; 180 - 183.

8.  W. Pyka, V. Sukharev, K. Kumar, S. Joh, J.E. McInerney:
"A 3D Integrated Simulation of Across-Wafer Metal Stack Gap-Fill for Local Interconnect Applications";
Poster: International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara; 1999-09-07 - 1999-09-09; in: "Proceedings of the 16th Intl. VLSI Multilevel Interconnection Conf.", (1999), 477 - 479.

7.  W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr:
"Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0; 199 - 202. https://doi.org/10.1109/SISPAD.1999.799295

6.  W. Pyka, H. Kirchauer, S. Selberherr:
"Three-Dimensional Resist Development Simulation - Benchmarks and Integration with Lithography";
Talk: Micro- and Nano-Engineering Conference, Rom; 1999-09-21 - 1999-09-23; in: "Abstracts Micro-and-Nano-Engineering 99 Conf.", (1999), 305 - 306.

5.  W. Pyka, R. Martins, S. Selberherr:
"Efficient Algorithms for Three-Dimensional Etching and Deposition Simulation";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4; 16 - 19. https://doi.org/10.1007/978-3-7091-6827-1_5

4.  R. Martins, W. Pyka, R. Sabelka, S. Selberherr:
"Modeling Integrated Circuit Interconnections";
Talk: International Conference on Microelectronics and Packaging, Curitiba; 1998-08-10 - 1998-08-14; in: "Proceedings XIII SBMicro, Intl. Conf. on Microelectronics and Packaging", (1998), 144 - 151.

3.  R. Martins, R. Sabelka, W. Pyka, S. Selberherr:
"Rigorous Capacitance Simulation of DRAM Cells";
Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in: "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4; 69 - 72. https://doi.org/10.1007/978-3-7091-6827-1_20

2.  W. Pyka, S. Selberherr:
"Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization";
Poster: International Conference on Modeling and Simulation of Microsystems (MSM), Santa Clara; 1998-05-06 - 1998-05-08; in: "Proceedings Intl. Conf. on Modeling and Simulation of Microsystems", (1998), ISBN: 0-9666135-0-3; T4.3.3.

1.  W. Pyka, S. Selberherr:
"Three-Dimensional Simulation of TiN Magnetron Sputter Deposition";
Talk: European Solid-State Device Research Conference (ESSDERC), Bordeaux; 1998-09-07 - 1998-09-09; in: "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (1998), ISBN: 2-86332-234-6; 324 - 327.

Doctor's Theses (authored and supervised)

1.  W. Pyka:
"Feature Scale Modeling for Etching and Deposition Processes in Semiconductor Manufacturing";
Supervisor, Reviewer: S. Selberherr, W. Fallmann; Institut für Mikroelektronik, 2000; oral examination: 2000-05-11.

Scientific Reports

2.  T. Grasser, A. Hössinger, R. Kosik, R. Mlekus, W. Pyka, M. Stockinger, S. Selberherr:
"VISTA Status Report December 1999";
1999; 58 pages.

1.  K. Dragosits, T. Grasser, H. Kosina, R. Mlekus, W. Pyka, S. Selberherr:
"VISTA Status Report June 1998";
1998; 19 pages.