Publications Wolfgang Pyka
21 records
| 7. | C. Heitzinger, W. Pyka, N. Tamaoki, T. Takase, T. Ohmine, S. Selberherr: "Simulation of Arsenic In Situ Doping With Polysilicon CVD and Its Application to High Aspect Ratio Trenches"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 22, (2003), 285 - 292 doi:10.1109/TCAD.2002.807879. BibTeX |
| 6. | H. Puchner, R. Castagnetti, W. Pyka: "Minimizing Thick Resist Sidewall Slope Dependence on Design Geometry by Optimizing Bake Conditions"; Microelectronic Engineering, 53, (2000), 429 - 432. BibTeX |
| 5. | W. Pyka, H. Kirchauer, S. Selberherr: "Three-Dimensional Resist Development Simulation - Benchmarks and Integration with Lithography"; Microelectronic Engineering, 53, (2000), 449 - 452 doi:10.1016/S0167-9317(00)00353-1. BibTeX |
| 4. | W. Pyka, R. Martins, S. Selberherr: "Optimized Algorithms for Three-Dimensional Cellular Topography Simulation"; IEEE Journal of Technology Computer Aided Design, 1, (2000), 1 - 36 doi:10.1109/TCAD.1996.6449177. BibTeX |
| 3. | P. Fleischmann, W. Pyka, S. Selberherr: "Mesh Generation for Application in Technology CAD"; IEICE Transactions on Electronics, E82-C, (invited) (1999), 937 - 947. BibTeX |
| 2. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Three-Dimensional Simulation of HPCVD - Linking Continuum Transport and Reaction Kinetics with Topography Simulation"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 18, (1999), 1741 - 1749 doi:10.1109/43.811323. BibTeX |
| 1. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "High-Precision Interconnect Analysis"; IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, 17, (1998), 1148 - 1159 doi:10.1109/43.736187. BibTeX |
| 11. | A. Hössinger, T. Binder, W. Pyka, S. Selberherr: "Advanced Hybrid Cellular Based Approach for Three-Dimensional Etching and Deposition Simulation"; Poster: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6, 424 - 427 doi:10.1007/978-3-7091-6244-6_98. BibTeX |
| 10. | W. Pyka, C. Heitzinger, N. Tamaoki, T. Takase, T. Ohmine, S. Selberherr: "Monitoring Arsenic In-Situ Doping with Advanced Models for Poly-Silicon CVD"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Athens, Greece; 2001-09-05 - 2001-09-07; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (2001), ISBN: 3-211-83708-6, 124 - 127 doi:10.1007/978-3-7091-6244-6_27. BibTeX |
| 9. | W. Pyka, S. Selberherr, V. Sukharev: "Incorporation of Equipment Simulation into Integrated Feature Scale Profile Evolution"; Talk: European Solid-State Device Research Conference (ESSDERC), Cork; 2000-09-11 - 2000-09-13; in "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (2000), ISBN: 2-86332-248-6, 180 - 183. BibTeX |
| 8. | W. Pyka, H. Kirchauer, S. Selberherr: "Three-Dimensional Resist Development Simulation - Benchmarks and Integration with Lithography"; Talk: Micro- and Nano-Engineering Conference, Rom; 1999-09-21 - 1999-09-23; in "Abstracts Micro-and-Nano-Engineering 99 Conf.", (1999), 305 - 306. BibTeX |
| 7. | W. Pyka, V. Sukharev, K. Kumar, S. Joh, J.E. McInerney: "A 3D Integrated Simulation of Across-Wafer Metal Stack Gap-Fill for Local Interconnect Applications"; Poster: International VLSI Multilevel Interconnection Conference (VMIC), Santa Clara; 1999-09-07 - 1999-09-09; in "Proceedings of the 16th Intl. VLSI Multilevel Interconnection Conf.", (1999), 477 - 479. BibTeX |
| 6. | W. Pyka, P. Fleischmann, B. Haindl, S. Selberherr: "Linking Three-Dimensional Topography Simulation with High Pressure CVD Reaction Kinetics"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kyoto, Japan; 1999-09-06 - 1999-09-08; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1999), ISBN: 4-930813-98-0, 199 - 202 doi:10.1109/SISPAD.1999.799295. BibTeX |
| 5. | W. Pyka, S. Selberherr: "Three-Dimensional Simulation of TiN Magnetron Sputter Deposition"; Talk: European Solid-State Device Research Conference (ESSDERC), Bordeaux; 1998-09-07 - 1998-09-09; in "Proceedings of the European Solid-State Device Research Conference (ESSDERC)", (1998), ISBN: 2-86332-234-6, 324 - 327. BibTeX |
| 4. | R. Martins, R. Sabelka, W. Pyka, S. Selberherr: "Rigorous Capacitance Simulation of DRAM Cells"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4, 69 - 72 doi:10.1007/978-3-7091-6827-1_20. BibTeX |
| 3. | W. Pyka, R. Martins, S. Selberherr: "Efficient Algorithms for Three-Dimensional Etching and Deposition Simulation"; Talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Leuven, Belgium; 1998-09-02 - 1998-09-04; in "Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)", (1998), ISBN: 3-211-83208-4, 16 - 19 doi:10.1007/978-3-7091-6827-1_5. BibTeX |
| 2. | R. Martins, W. Pyka, R. Sabelka, S. Selberherr: "Modeling Integrated Circuit Interconnections"; Talk: International Conference on Microelectronics and Packaging, Curitiba; 1998-08-10 - 1998-08-14; in "Proceedings XIII SBMicro, Intl. Conf. on Microelectronics and Packaging", (1998), 144 - 151. BibTeX |
| 1. | W. Pyka, S. Selberherr: "Three-Dimensional Simulation of Bulge Formation in Contact Hole Metalization"; Poster: International Conference on Modeling and Simulation of Microsystems (MSM), Santa Clara; 1998-05-06 - 1998-05-08; in "Proceedings Intl. Conf. on Modeling and Simulation of Microsystems", (1998), ISBN: 0-9666135-0-3, T4.3.3.. BibTeX |
| 1. | W. Pyka: "Feature Scale Modeling for Etching and Deposition Processes in Semiconductor Manufacturing"; Reviewer: S. Selberherr, W. Fallmann; Institut für Mikroelektronik, 2000, oral examination: 2000-05-11. BibTeX |
| 2. | T. Grasser, A. Hössinger, R. Kosik, R. Mlekus, W. Pyka, M. Stockinger, S. Selberherr: "VISTA Status Report December 1999"; (1999), 58 page(s) . BibTeX |
| 1. | K. Dragosits, T. Grasser, H. Kosina, R. Mlekus, W. Pyka, S. Selberherr: "VISTA Status Report June 1998"; (1998), 19 page(s) . BibTeX |