Erasmus Langer
Siegfried Selberherr
Hajdin Ceric
Johann Cervenka
Siddhartha Dhar
Robert Entner
Wolfgang Gös
Klaus-Tibor Grasser
René Heinzl
Christian Hollauer
Stefan Holzer
Andreas Hössinger
Gerhard Karlowatz
Markus Karner
Hans Kosina
Ling Li
Gregor Meller
Mihail Nedjalkov
Alexandre Nentchev
Vassil Palankovski
Mahdi Pourfath
Philipp Schwaha
Alireza Sheikholeslami
Michael Spevak
Viktor Sverdlov
Oliver Triebl
Enzo Ungersboeck
Martin-Thomas Vasicek
Stanislav Vitanov
Martin Wagner
Wilfried Wessner
Robert Wittmann

Klaus-Tibor Grasser
Ao.Univ.Prof. Dipl.-Ing. Dr.techn.
grasser(!at)iue.tuwien.ac.at
Biography:
Klaus-Tibor Grasser was born in Vienna, Austria, in 1970. He received the Diplomingenieur degree in communications engineering, the Ph.D. degree in technical sciences, and the venia docendi degree in microelectronics from the Technische Universität Wien, in 1995, 1999, and 2002, respectively. He is currently employed as an Associate Professor at the Institute for Microelectronics. Since 1997 he has headed the Minimos-NT development group, working on the successor of the highly successful MiniMOS program. He was a visiting research engineer for Hitachi Ltd., Tokyo, Japan, and for the Alpha Development Group, Compaq Computer Corporation, Shrewsbury, USA. In 2003 he was appointed head of the Christian Doppler Laboratory for TCAD in Microelectronics, an industry funded research group embedded in the Institute for Microelectronics. His current scientific interests include circuit and device simulation, device modeling, physical and software aspects in general.

Hydrogen in Semiconductors

Hydrogen is linked to a number of important phenomena occuring in semiconductor devices. The most important is probably the passivation of undesired electrically active interface defects through hydrogen exposure during processing. During long term operation the interface defects can be depassivated again, leading to a considerable change of the electrical characteristics over time and to increased failure rates. Depassivation can occur, for instance, due to the exposure to higher temperatures, higher gate voltages, and hot carrier injection from the channel in MOS devices. In addition, exposure to highly reactive atomic and protonic hydrogen can result in depassivation as well, depending on a complex interplay of various reactions. In the semiconductor bulk, hydrogen can passivate electrically active shallow dopands, which can also have a profound influence on the electrical behavior of the semiconductor device. As with interface states, these hydrogen/dopand complexes can be broken, again resulting in a shift of the device characteristics. Inside insulators, hydrogen species can interact with or even create new defects, which changes the threshold voltage of MOS transistors. Hydrogen is known to occur in a number of different configurations, most notably as a proton or in molecular form. Atomic hydrogen is known to be unstable but may be an important temporary quantity before it passivates/depassivates a defect or dimerizes into molecular hydrogen. As a consequence, there are two fundamental modeling issues: creation/annihilation of different hydrogen species and the motion of each species through the various material layers. To properly describe the interaction of the hydrogen species with interface, bulk, and oxide defects, a number of reactions have to be considered. The associated reactions depend strongly on the charge state of the defect, further increasing the complexity of the problem. Transport of the hydrogen species may be strongly influenced by shallow and deep traps, resulting in dispersive behavior. In contrast to conventional diffusion, dispersive transport is characterized by an unusually strong spreading of a particle packet, resulting in an extremely long transient tail.


Some important reactions of hydrogen species with interface and oxide defects.


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