Erasmus Langer
Siegfried Selberherr
Hajdin Ceric
Johann Cervenka
Siddhartha Dhar
Robert Entner
Wolfgang Gös
Klaus-Tibor Grasser
René Heinzl
Christian Hollauer
Stefan Holzer
Andreas Hössinger
Gerhard Karlowatz
Markus Karner
Hans Kosina
Ling Li
Gregor Meller
Mihail Nedjalkov
Alexandre Nentchev
Vassil Palankovski
Mahdi Pourfath
Philipp Schwaha
Alireza Sheikholeslami
Michael Spevak
Viktor Sverdlov
Oliver Triebl
Enzo Ungersboeck
Martin-Thomas Vasicek
Stanislav Vitanov
Martin Wagner
Wilfried Wessner
Robert Wittmann

Robert Wittmann
Dipl.-Ing.
wittmann(!at)iue.tuwien.ac.at
Biography:
Robert Wittmann was born in Vienna, Austria, in 1966. He studied computer engineering at the Technische Universitä t Wien, where he received the degree of Diplomingenieur in 2002. From 1989 to 1997 he worked as a development engineer for communication systems at the company Kapsch Group, Vienna. He joined the Institute for Microelectronics in June 2002, where he is currently working on his doctoral degree. From July to October 2004 he held a visiting research position at Cypress Semiconductor in San Jose, USA. His scientific interests include Monte Carlo simulation of ion implantation and NBTI reliability.

Investigation of Doping Profiles and Reliability for CMOS Technology

Conventional six-transistor CMOS SRAM cell structures are dominantly employed in today's cache memory blocks for advanced microprocessors. The long-term stability of such a memory cell is strongly affected by NBTI (negative bias temperature instability) induced degradation of p-MOSFET parameters (e.g., threshold voltage). The AC degradation is significantly lower than the DC degradation, since interface traps generated during the on-state of the transistor are partially annealed in the off-state. Although several NBTI models have been developed to explain the physics of interface trap generation based on electrochemical reactions and activation energies, only the reaction-diffusion (R-D) model can explain the power-law time dependence of the parameter degradation. The two p-MOSFETs in a 6T-SRAM cell are unsymmetrically NBT stressed by the stored bit values (only one of them is "on"). We have determined the lifetime extension related to the DC lifetime of the cell as a function of the probability for storing one bit between 100% (DC stress) and 50% (symmetric AC stress) every second. The NBTI response to random bit sequences is numerically simulated with a calibrated reaction-diffusion model. Germanium has regained attention in the semiconductor industry as a potential future replacement for silicon in high-performance CMOS applications. Recently, Ge-based MOS transistors with a mobility improvement three times that of silicon devices were successfully processed using a high-k dielectric. However, the accurate simulation of ion implantation processes in Ge is required for the optimization of doping profiles in such CMOS applications. We studied boron implantation in Ge by using our Monte Carlo ion implantation simulator MCIMPL-II and SIMS measurements. The multi-dimensional simulator is based on the BCA method and uses the universal ZBL potential. The larger nuclear and electronic stopping power of Ge is responsible for the shallower boron profile in Ge. The generated point defects and amorphized regions in the crystal are estimated by using a modified Kinchin-Pease model. We found that the higher displacement energy in Ge, the stronger backscattering effect, and the smaller energy transfer from the ion to the primary recoil of a cascade are mainly responsible for the significantly reduced damage in Ge. The simulated point responses revealed that the boron distribution is significantly reduced in Ge in the vertical direction while the lateral profile is quite similar in Si and Ge.


Simulated NBTI response for storing random bit values every second with 90% probability for one bit



Simulated point responses for a boron implantation into crystalline Si and Ge.


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