Erasmus Langer
Siegfried Selberherr
Hajdin Ceric
Johann Cervenka
Siddhartha Dhar
Robert Entner
Wolfgang Gös
Klaus-Tibor Grasser
René Heinzl
Christian Hollauer
Stefan Holzer
Andreas Hössinger
Gerhard Karlowatz
Markus Karner
Hans Kosina
Ling Li
Gregor Meller
Mihail Nedjalkov
Alexandre Nentchev
Vassil Palankovski
Mahdi Pourfath
Philipp Schwaha
Alireza Sheikholeslami
Michael Spevak
Viktor Sverdlov
Oliver Triebl
Enzo Ungersboeck
Martin-Thomas Vasicek
Stanislav Vitanov
Martin Wagner
Wilfried Wessner
Robert Wittmann

Andreas Hössinger
Dipl.-Ing. Dr.techn.
hossinger(!at)iue.tuwien.ac.at
Biography:
Andreas Hössinger was born in St. Pölten, Austria, in 1969. He studied technical physics at the Technische Universitä t Wien, where he received the degree of Diplomingenieur in January, 1996. He joined the Institute for Microelectronics in June 1996. In 1998 he held a visiting research position at Sony in Atsugi, Japan. In September 2000 he finished his Ph.D. degree. In 2001 he held a position as a visiting researcher at LSI Logic in Santa Clara, CA, USA, within the scope of a cooperate research project on three-dimensional process simulation. In 2001 he received a grant from the Austrian Academy of Science within the scope of the Austrian Program for Advanced Research and Technology.

Characterization of Ion Implantation for non-Si Materials

Non-silicon semiconductor materials have become more and more important in the development and implementation of advanced technology nodes. The most prominent of these materials are silicon-germanium compounds, because they facilitate performance tuning via stress engineering, and they are reasonably compatible with silicon-based technology. Therefore accurate simulation modules which can deal with these silicon-germanium compound materials are necessary. One of the most critical process modules is ion implantation, which requires, on the one hand, accurate implantation tables for the analytical simulation analysis of ion implantation and, on the other hand, advanced and well-calibrated Monte-Carlo ion implantation simulation capabilities. Therefore a Monte-Carlo ion implantation simulation module for the accurate simulation of ion implantation into silicon-germanium compound semiconductor material has been developed. Since quantitatively predictive capabilities are a must for a Monte-Carlo ion implantation simulator, extensive evaluation and calibration of the simulation tool on the basis of experimental results is inevitable. For this purpose, a set of specifically selected experiments has been developed and carried out. On the basis of these experiments the independent analysis of the various effects, which characterize the implantation behavior (channeling, damage accumulation) has been feasible. The experimental set-up is clearly distinguishable from usual industrial experimental analysis, which mainly focuses on typical fabrication conditions. Nevertheless, in order to ensure the applicability of the calibration to semiconductor technology requirements, usual silicon wafers with epitaxially grown silicon-germanium layers with various, but typical, germanium contents were used for the experiments. But not only the influence of the compound composition, but also the influence of epitaxially induced stress on the ion implantation behavior was investigated. As a side effect of such a comprehensive experimental analysis, implantation tables for analytical ion implantation simulation modules can also be worked out.


SiGe crystal model with lattice constant a(x)
for arbitrary Ge content x


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